TCOR

RTV Thermally Conductive Oxime

TCOR Thermally Conductive Oxime is a single component, high thermal conductivity RTV for the effective bonding or gap filling in electronic devices.

HTSP

Silicone Heat Transfer Compound Plus

HTSP provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils.

HTCX_ZF

Non-Silicone Thermal Interface Material

HTCX_ZF is a Zinc Oxide free version of Electrolube's highly successful Heat Transfer Compound Xtra (HTCX).

HTS

Silicone Heat Transfer Compound

Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive compound which will operate over a wide temperature range.

HTC

Non-Silicone Thermal Interface Material

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required.

HTCP

Non-Silicone Heat Transfer Compound Plus

HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

HTCX

Non-Silicone Thermal Interface Material

Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss.

GP300

Thermal Gap Pad

GP300 is a silicone based thermal interface gap pad designed for easy application and good thermal conductivity.

HTCPX

Thermal Gap Filler

HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

HTCX

Non-Silicone Thermal Interface Material

Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss.